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- Current location: HomeProducts & SolutionsFPC MaterialConsumer ElectronicsHigh Thermal Conductivity Bonding Sheet
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High Thermal Conductivity Bonding Sheet
- Adhesive Type: Modified Epoxy resin
- Dongyi Model: PS
- Application Scenario: FPC Stiffener/PI/FR4/Steel sheet/Multi-layer board
- Introduction: Used for the bonding of medium strength board, steel sheet, FR-4 and multi-layer board inner layer in the production of flexible circuit boards
Product Features:
Used for the bonding of medium strength board, steel sheet, FR-4 and multi-layer board inner layer in the production of flexible circuit boards
Product Structure:
Application Scenario:
electron
Camera
light bar
Product Parameters:
| 東溢型號(hào) | 膠厚(um) | 包裝規(guī)格 | ||
| DY model | AD Thickness | Packaging | ||
| PS25-250S(F) | 25 | 250mm*200m | ||
| PS25-500S(F) | 25 | 500mm*100m | ||
| PS50-250S(F) | 50 | 250mm*200m | ||
| PS50-500S(F) | 50 | 500mm*100m |
Data Download:
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South China Headquarters
GUANGDONG DONGYI HIGH -TECH MATERIAL SCIENCE&TECHNOLOGY CO., LTD.
[Factory 1] No. 22 Changsheng Road, South District, Zhongshan City, Guangdong Province
[Factory 2] No.1 Zhichuang Road, Banfu Town, Zhongshan City, Guangdong Province
Phone: 0760-88892634 0760-88895714
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East China Branch
JIANGSU JUTEK ADVANCED MATERIAL SCIENCE & TECHNOLOGY CO., LTD.(Be wholly-owned subsidiary by Guangdong Dongyi)
Address: Building 3, No. 255 Renmin Middle Road, Chongchuan District, Nantong City, Jiangsu Province
Phone: 0513-80979666
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