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Consumer Electronics Solution
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Product List:
- Adhesive Type:
- Dongyi Model: PS-S
- Application Scenario: Mainly used in electronic/industrial scenarios that require high-efficiency thermal conductivity and close-fitting sealing, such as heat-dissipating aluminum substrates and LED lighting.
- Introduction: Mainly used in electronic/industrial scenarios that require high-efficiency thermal conductivity and close-fitting sealing, such as heat-dissipating aluminum substrates and LED lighting.
- Adhesive Type:
- Dongyi Model: PM-M
- Application Scenario: reliability-such as flexible printed circuit boards (FPCBs)and new energy BMS battery systems--it prevents short circuits or signal attenuation caused by ion migration and extends the service life of products.
- Introduction: In electronic and industrial fields that have extremely high requirements for circuit protection, environmental safety.
- Adhesive Type:
- Dongyi Model: P-T
- Application Scenario: Its application fields are very extensive, with the core focus on products that have requirements for light transmittance.
- Introduction: Its application fields are very extensive, with the core focus on products that have requirements for light transmittance.
- Adhesive Type:
- Dongyi Model: PL
- Application Scenario: FPC Stiffener/PI/FR4/Steel sheet
- Introduction: It is mainly used in the manufacturing of electronic components and circuit boards, such as: inner-layer lamination of multi-layer boards, bonding of media with high anti-pollution requirements, and applications for high-frequency series products.
- Adhesive Type:
- Dongyi Model: PH
- Application Scenario: FPC Stiffener/PI/FR4/Steel sheet
- Introduction: It is mainly used in the manufacturing of electronic components and circuit boards, such as: inner-layer lamination of multi-layer boards, lamination of rigid-flex boards, chip packaging, etc.
- Adhesive Type:
- Dongyi Model: PE
- Application Scenario: FPC Stiffener/PI/FR4/Steel sheet
- Introduction: It is mainly used in the manufacturing of electronic components and circuit boards, such as: inner-layer lamination of multi-layer boards, lamination of rigid-flex boards, chip packaging, etc.
- Adhesive Type: A0/A1
- Dongyi Model: PA
- Application Scenario: FPC Stiffener/PI/FR4/Steel sheet
- Introduction: The product is served as a complementary product for flexible copperclad laminate,its functions include surface and heat insulation.
- Adhesive Type:
- Dongyi Model: DCIH
- Application Scenario: Car/Medical/Electronic
- Introduction: The product is mainly used as a protective film for notebookbattery and a protective film for FPCB and etc.
- Adhesive Type:
- Dongyi Model: DCWB
- Application Scenario: Car/Medical/Electronic
- Introduction: The product is mainly used as a protective film for notebookbattery and a protective film for FPCB and etc.
- Adhesive Type:
- Dongyi Model: DCIB(CAF)
- Application Scenario: Car/Medical/Electronic
- Introduction: The product is mainly used as a protective film for notebookbattery and a protective film for FPCB and etc.
- Adhesive Type:
- Dongyi Model: DCIS
- Application Scenario: Car/Medical/Electronic
- Introduction: It is applied in electronic/electrical equipment requiring temperature control, new energy, and industrial scenarios, and serves as a key material for enhancing equipment stability.
- Adhesive Type:
- Dongyi Model: DCBB
- Application Scenario: Car/Medical/Electronic
- Introduction: The product is mainly used as a protective film for notebookbattery and a protective film for FPCB and etc.
- Adhesive Type:
- Dongyi Model: DCWB
- Application Scenario: Car/Medical/Electronic
- Introduction: The product is mainly used as a protective film for notebookbattery and a protective film for FPCB and etc.
- Adhesive Type:
- Dongyi Model: DCIB
- Application Scenario: Car/Medical/Electronic
- Introduction: The product is mainly used as a protective film for notebookbattery and a protective film for FPCB and etc.
- Adhesive Type:
- Dongyi Model: DCIA
- Application Scenario: Car/Medical/Electronic
- Introduction: The product is mainly used as a protective film for notebookbattery and a protective film for FPCB and etc.
- Adhesive Type: Modified Acrylic resin
- Dongyi Model: P
- Application Scenario: FPC Stiffener/PI/FR4/Steel sheet
- Introduction: Used for the bonding of medium strength board, steel sheet, FR-4 and multi-layer board inner layer in the production of flexible circuit boards
- Adhesive Type: Modified Epoxy resin
- Dongyi Model: PE
- Application Scenario: FPC Stiffener/PI/FR4/Steel sheet/Multi-layer board
- Introduction: Used for the bonding of medium strength board, steel sheet, FR-4 and multi-layer board inner layer in the production of flexible circuit boards
- Adhesive Type: Modified solvent based Acrylic resin
- Dongyi Model: PH
- Application Scenario: FPC Stiffener/PI/FR4/Steel sheet
- Introduction: Used for the bonding of medium strength board, steel sheet, FR-4 and multi-layer board inner layer in the production of flexible circuit boards
- Adhesive Type: Modified Polyimide resin
- Dongyi Model: PL
- Application Scenario: FPC補(bǔ)強(qiáng)/PI/FR4/鋼片
- Introduction: Used for the bonding of medium strength board, steel sheet, FR-4 and multi-layer board inner layer in the production of flexible circuit boards
- Adhesive Type: Modified Epoxy resin
- Dongyi Model: PS
- Application Scenario: FPC Stiffener/PI/FR4/Steel sheet/Multi-layer board
- Introduction: Used for the bonding of medium strength board, steel sheet, FR-4 and multi-layer board inner layer in the production of flexible circuit boards
- Adhesive Type: Modified Epoxy resin
- Dongyi Model: DCIB
- Application Scenario: Car/Medical/Electronic
- Introduction: Used as a protective film for flexible circuit boards or laptop batteries, etc
- Adhesive Type: Modified Epoxy resin
- Dongyi Model: DCIB/DCBB
- Application Scenario: Electronic/Camera
- Introduction: Used as a protective film for flexible circuit boards or laptop batteries, etc
- Adhesive Type: Modified Epoxy resin
- Dongyi Model: DCWB
- Application Scenario: Light strip/backlight
- Introduction: Used as a protective film for flexible circuit boards or laptop batteries, etc
- Adhesive Type: Modified Polyimide resin
- Dongyi Model: DCIL
- Application Scenario: Car/Medical/Electronic
- Introduction: Used as a protective film for flexible circuit boards or laptop batteries, etc
- Adhesive Type: Modified Epoxy resin
- Dongyi Model: DCIS
- Application Scenario: Car/Medical/Electronic
- Introduction: Used as a protective film for flexible circuit boards or laptop batteries, etc
- Adhesive Type: Inner Layer：Modified Epoxy resin
- Dongyi Model: DTIX
- Application Scenario: FPC Stiffener
- Introduction: Used for enhancing the insertion and removal of gold fingers and other parts in flexible circuit boards.
- Adhesive Type: Inner Layer：Modified Epoxy resin + Outer Layer: Modified Acrylic resin
- Dongyi Model: DTIA
- Application Scenario: FPC Stiffener
- Introduction: Used for enhancing the insertion and removal of gold fingers and other parts in flexible circuit boards.
- Adhesive Type: Modified Epoxy resin
- Dongyi Model: DSIF/DSEB/DDIF
- Application Scenario: Car/Medical/Electronic
- Introduction: Single panel: mainly used for laptop monitors, mobile phone antenna boards, etc Double sided panel: mainly used for electronic industry instruments, communication equipment, etc
- Adhesive Type: Modified Epoxy resin
- Dongyi Model: DSIF/DSEB/DDIF
- Application Scenario: Car/Medical/Electronic
- Introduction: Single panel: mainly used for laptop monitors, mobile phone antenna boards, etc Double sided panel: mainly used for electronic industry instruments, communication equipment, etc

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