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- Current location: HomeProducts & SolutionsFPC MaterialConsumer ElectronicsLow Dk/Df Bonding Sheet
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Low Dk/Df Bonding Sheet
- Adhesive Type:
- Dongyi Model: PL
- Application Scenario: FPC Stiffener/PI/FR4/Steel sheet
- Introduction: It is mainly used in the manufacturing of electronic components and circuit boards, such as: inner-layer lamination of multi-layer boards, bonding of media with high anti-pollution requirements, and applications for high-frequency series products.
Product Features:
It is mainly used in the manufacturing of electronic components and circuit boards, such as: inner-layer lamination of multi-layer boards, bonding of media with high anti-pollution requirements, and applications for high-frequency series products.
Product Structure:
Application Scenario:
electron
Camera
light bar
Product Parameters:
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South China Headquarters
GUANGDONG DONGYI HIGH -TECH MATERIAL SCIENCE&TECHNOLOGY CO., LTD.
[Factory 1] No. 22 Changsheng Road, South District, Zhongshan City, Guangdong Province
[Factory 2] No.1 Zhichuang Road, Banfu Town, Zhongshan City, Guangdong Province
Phone: 0760-88892634 0760-88895714
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East China Branch
JIANGSU JUTEK ADVANCED MATERIAL SCIENCE & TECHNOLOGY CO., LTD.(Be wholly-owned subsidiary by Guangdong Dongyi)
Address: Building 3, No. 255 Renmin Middle Road, Chongchuan District, Nantong City, Jiangsu Province
Phone: 0513-80979666
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