Application Scenario: Used for glass cutting, wafer cutting, and lens chip cutting protection, it has extremely high initial bonding strength and instantly loses adhesion after UV irradiation, making it easy to peel off.
Introduction: Used for glass cutting, wafer cutting, and lens chip cutting protection, it has extremely high initial bonding strength and instantly loses adhesion after UV irradiation, making it easy to peel off.
Product Features:
Used for glass cutting, wafer cutting, and lens chip cutting protection, it has extremely high initial bonding strength and instantly loses adhesion after UV irradiation, making it easy to peel off.